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STTH8L06
TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER
Table 1: Main Product Characteristics IF(AV) VRRM IR (max) Tj VF (typ) trr (typ) FEATURES AND BENEFITS

8A 600 V 200 A 175C 0.85 V 75 ns
K
A
K
A
K
TO-220AC STTH8L06D
TO-220FPAC STTH8L06FP
K
Ultrafast switching Low reverse recovery current Low thermal resistance Reduces switching and conduction losses
K
A A NC
DESCRIPTION The STTH8L06, which is using ST Turbo2 600V technology, is specially suited as boost diode in discontinuous or critical mode power factor corrections. The device is also intended for use as a free wheeling diode in power supplies and other power switching applications.
TO-220AC Insulated STTH8L06DI Table 2: Order Codes Part Number STTH8L06D STTH8L06FP STTH8L06DI STTH8L06DIRG STTH8L06G STTH8L06G-TR
D2PAK STTH8L06G
Marking STTH8L06D STTH8L06FP STTH8L06DI STTH8L06DI STTH8L06G STTH8L06G
Table 3: Absolute Ratings (limiting values) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) IF(AV) TO-220AC / TO-220FPAC TO-220AC Ins. Average forward current TO-220AC Tc = 150C = 0.5 TO-220FPAC Tc = 125C TO-220AC Ins. Tc = 135C Surge non repetitive forward current tp = 10ms sinusoidal Storage temperature range Maximum operating junction temperature RMS forward voltage Value 600 30 24 8 Unit V A A
IFSM Tstg Tj
120 -65 to + 175 175
A C C
October 2004
REV. 3
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Table 4: Thermal Resistance Symbol Rth(j-c) Junction to case Parameter TO-220AC / D2PAK TO-220FPAC TO-220AC Ins. Value (max). 2.5 5 4 Unit C/W
Table 5: Static Electrical Characteristics Symbol IR VF Parameter Test conditions VR = VRRM 16 IF = 8A 0.85
2
Min.
Typ
Max. 8 200 1.3 1.05
Unit A
Reverse leakage current Tj = 25C Tj = 150C Forward voltage drop Tj = 25C Tj = 150C
V
To evaluate the conduction losses use the following equation: P = 0.89 x IF(AV) + 0.022 IF (RMS)
Table 6: Dynamic Characteristics Symbol trr tfr VFP Parameter Reverse recovery time Forward recovery time Forward recovery voltage Tj = 25C Tj = 25C Test conditions IF = 1A dIF/dt = 50 A/s VR =30V IF = 8A dIF/dt = 100 A/s VFR = 1.1 x VFmax IF = 8A dIF/dt = 100 A/s Min. Typ Max. Unit 75 105 150 6 ns ns V
Figure 1: Conduction losses versus average current
P(W)
11 10 9
=1 = 0.05 = 0.1 = 0.2 = 0.5
Figure 2: Forward voltage drop versus forward current
IFM(A)
100.0
Tj=150C (maximum values) Tj=25C (maximum values)
8 7 6 5 4 3 2 1 0 0 2 4 6 1.0 10.0
Tj=150C (typical values)
T
IF(AV)(A)
=tp/T
8
tp
0.1 10 0.0 0.5 1.0
VFM(V)
1.5 2.0 2.5 3.0
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Figure 3: Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAC)
Zth(j-c)/Rth(j-c)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-03 1.E-02 1.E-01
Figure 4: Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC, TO-220AC Ins., D2PAK)
Zth(j-c)/Rth(j-c)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3
Single pulse
T
Single pulse
0.2 0.1
T
tp(s)
=tp/T
1.E+00
tp
1.E+01
tp(s)
1.E-02 1.E-01
0.0 1.E-03
=tp/T
tp
1.E+00
Figure 5: Peak reverse recovery current versus dIF/dt (typical values)
IRM(A)
14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 20 40 60 80 100 120 140 160 180 200
IF=0.25 x IF(AV) IF=0.5 x IF(AV) IF=IF(AV) VR=400V Tj=125C IF=2 x IF(AV)
Figure 6: Reverse recovery time versus dIF/dt (typical values)
trr(ns)
1000 900 800 700 600 500 400 300 200
IF=2 x IF(AV) IF=IF(AV) IF=0.5 x IF(AV) VR=400V Tj=125C
dIF/dt(A/s)
100 0 0 20 40 60
dIF/dt(A/s)
80 100 120 140 160 180 200
Figure 7: Reverse recovery charges versus dIF/dt (typical values)
Qrr(nC)
1000 900 800 700 600 500 400 300 200 100 0 0 20 40 60 80 100 120 140 160 180 200
IF=0.5 x IF(AV) IF=IF(AV) VR=400V Tj=125C IF=2 x IF(AV)
Figure 8: Softness factor versus dIF/dt (typical values)
S factor
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4
IF2 x IF(AV) VR=400V Tj=125C
dIF/dt(A/s)
0.2 0.0 0 25 50 75
dIF/dt(A/s)
100 125 150 175 200
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STTH8L06
Figure 9: Relative variations of dynamic parameters versus junction temperature
1.25
S factor
Figure 10: Transient peak forward voltage versus dIF/dt
VFP(V)
7
IF=IF(AV) Tj=125C
1.00
IRM
6 5 4 3
IF 2 x IF(AV) VR=400V Reference: Tj=125C
0.75
QRR
0.50
0.25
2 1
Tj(C)
0.00 25 50 75 100 125
dIF/dt(A/s)
0 0 20 40 60 80 100 120 140 160 180 200
Figure 11: Forward recovery time versus dIF/dt (typical values)
tfr(ns)
300
IF=IF(AV) VFR=1.1 x VF max. Tj=125C
Figure 12: Junction capacitance versus reverse voltage applied (typical values)
C(pF)
1000
F=1MHz VOSC=30mVRMS Tj=25C
250
200
100
150
100
10
50
dIF/dt(A/s)
0 0 20 40 60 80 100 120 140 160 180 200 1 1 10
VR(V)
100 1000
Figure 13: Thermal resistance junction to ambient versus copper surface under tab (epoxy FR4, eCU=35m) (D2PAK)
Rth(j-a)(C/W)
70 60 50 40 30 20 10
S(Cu)(cm)
0 0 5 10 15 20 25 30 35 40
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STTH8L06
Figure 14: D2PAK Package Mechanical Data DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 2.49 2.69 0.098 0.106 0.03 0.23 0.001 0.009 0.70 0.93 0.027 0.037 1.14 1.70 0.045 0.067 0.45 0.60 0.017 0.024 1.23 1.36 0.048 0.054 8.95 9.35 0.352 0.368 10.00 10.40 0.393 0.409 4.88 5.28 0.192 0.208 15.00 15.85 0.590 0.624 1.27 1.40 0.050 0.055 1.40 1.75 0.055 0.069 2.40 3.20 0.094 0.126 0.40 typ. 0.016 typ. 0 8 0 8
REF.
A E L2 C2
D L L3 A1 B2 B G A2 C R
M
*
V2
* FLAT ZONE NO LESSTHAN 2mm
A A1 A2 B B2 C C2 D E G L L2 L3 M R V2
Figure 15: D2PAK Foot Print Dimensions (in millimeters)
16.90
10.30 1.30
5.08
3.70 8.90
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STTH8L06
Figure 16: TO-220FPAC Package Mechanical Data DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.4 4.6 0.173 0.181 2.5 2.7 0.098 0.106 2.5 2.75 0.098 0.108 0.45 0.70 0.017 0.027 0.75 1 0.030 0.039 1.15 1.70 0.045 0.067 1.15 1.70 0.045 0.067 4.95 5.20 0.195 0.204 2.40 2.70 0.094 0.106 10 10.4 0.393 0.409 16 Typ. 0.63 Typ. 28.6 30.6 1.126 1.204 9.8 10.6 0.385 0.417 15.9 16.4 0.626 0.645 9.00 9.30 0.354 0.366 3 3.20 0.118 0.126
REF.
A H B
Dia L6 L2 L3 L5 D F1 L4 L7
F G1 G
E
A B D E F F1 F2 G G1 H L2 L3 L4 L6 L7 Dia.
Figure 17: TO-220AC Insulated Package Mechanical Data DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 1.23 1.32 0.048 0.051 2.40 2.72 0.094 0.107 0.49 0.70 0.019 0.027 0.61 0.88 0.024 0.034 1.14 1.70 0.044 0.066 4.95 5.15 0.194 0.202 10.00 10.40 0.393 0.409 16.40 typ. 0.645 typ. 13.00 14.00 0.511 0.551 2.65 2.95 0.104 0.116 15.25 15.75 0.600 0.620 6.20 6.60 0.244 0.259 3.50 3.93 0.137 0.154 2.6 typ. 0.102 typ. 3.75 3.85 0.147 0.151
REF.
H2 C L5 OI L6 L2 D L7 A
L9 F1 L4
F G
M E
A C D E F F1 G H2 L2 L4 L5 L6 L7 L9 M Diam. I
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STTH8L06
Figure 18: TO-220AC Package Mechanical Data REF. A C D E F F1 G H2 L2 L4 L5 L6 L7 L9 M Diam. I DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 1.23 1.32 0.048 0.051 2.40 2.72 0.094 0.107 0.49 0.70 0.019 0.027 0.61 0.88 0.024 0.034 1.14 1.70 0.044 0.066 4.95 5.15 0.194 0.202 10.00 10.40 0.393 0.409 16.40 typ. 0.645 typ. 13.00 14.00 0.511 0.551 2.65 2.95 0.104 0.116 15.25 15.75 0.600 0.620 6.20 6.60 0.244 0.259 3.50 3.93 0.137 0.154 2.6 typ. 0.102 typ. 3.75 3.85 0.147 0.151
H2 C L5 OI L6 L2 D
A
L7
L9 F1 L4
F G
M E
Table 7: Ordering Information Ordering type STTH8L06D STTH8L06FP STTH8L06DI STTH8L06DIRG STTH8L06G STTH8L06G-TR

Marking STTH8L06D STTH8L06FP STTH8L06DI STTH8L06DI STTH8L06G STTH8L06G
Package TO-220AC TO-220FPAC TO-220AC Ins. TO-220AC Ins D2PAK D2PAK
Weight 1.90 g 1.70 g 1.86 g 1.86 g 1.48 g 1.48 g
Base qty Delivery mode 50 Tube 50 Tube 250 Box 50 Tube 50 Tube 1000 Tape & reel
Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 m.N. (TO-220FPAC) / 0.55 m.N. (TO-220AC) Maximum torque value: 1.0 m.N. (TO-220FPAC) / 0.70 m.N. (TO-220AC)
Table 8: Revision History Date Nov-2002 18-Oct-2004 Revision 2A 3 Description of Changes Last issue TO-220AC Insulated and D2PAK packages added
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STTH8L06
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
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